Precision Soldering for SMT & Complex PCB Assemblies
Manufyn offers highly controlled and consistent reflow soldering services for surface mount technology (SMT) and complex component assemblies. Our reflow soldering systems are engineered for precision temperature profiling, enabling defect-free joints across single and double sided reflow soldering projects.
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Reflow soldering is a thermal process where solder paste, applied to PCB pads, is melted using heat to form secure electrical connections between surface-mount components and the board.
If you’re asking what is reflow soldering, it’s the most widely used method in PCB assembly due to its efficiency, scalability, and compatibility with automated manufacturing lines.
Our reflow soldering process ensures repeatability and consistency at every step:
Solder paste is printed on PCB pads through a stencil.
SMT components, including BGAs and fine-pitch ICs, are placed on the paste using pick-and-place machines.
The assembly moves through a reflow soldering system, heating in stages to melt and re-solidify solder in controlled conditions.
We use AOI and X-ray (for BGA reflow soldering) to verify joint quality and alignment.
This reflow process soldering is optimized for temperature, airflow, and dwell time to avoid tombstoning, cold joints, or bridging.
Every board requires a specific reflow soldering profile — a time-temperature curve that defines how heat is applied during the process. At Manufyn, we fine-tune profiles based on:
Manufyn specializes in BGA reflow soldering, where solder joints are hidden beneath the package. We use:
Whether for telecom, industrial, or medical electronics, our BGA process is built for quality and precision.
Flow soldering vs reflow soldering:
Reflow soldering is used for surface mount components with solder paste.
Flow soldering (wave soldering) is used mainly for through-hole components.
Flow soldering (wave soldering) is used mainly for through-hole components.
Fully programmable reflow soldering systems with multiple zones for even temperature control.
Custom reflow soldering profiles based on component and PCB layout, ensuring safe and complete soldering.
Precision bga reflow soldering with full X-ray validation.
We offer double sided reflow soldering for dense, complex boards.
All boards undergo post-reflow inspection for solder joint accuracy and IPC compliance.
Our reflow soldering services are trusted by industries such as:
Partner with Manufyn to tap into India’s manufacturing strengths. From prototyping to mass production, we offer tailored solutions that deliver quality, efficiency, and reliability, all at a competitive cost.
From reflow soldering for complex SMT assemblies to BGA reflow soldering with full X-ray validation, Manufyn is your one-stop solution for consistent and scalable electronics manufacturing. Contact us today.
Reflow soldering is a process that melts solder paste to connect SMT components to PCB pads using controlled heat profiles.
The reflow soldering process includes applying solder paste, placing components, heating in a reflow oven, and cooling for joint solidification.
A reflow soldering profile defines the heat stages (preheat, soak, reflow, cooling) and timing to ensure solder melts and bonds without damaging parts.
Reflow soldering is used for SMT, while wave soldering (also called flow soldering) is typically used for through-hole components.
Yes, we offer double sided reflow soldering, carefully controlling profiles to avoid remelting or damaging already-soldered parts.
We use advanced reflow soldering systems with multi-zone ovens, nitrogen atmosphere (when needed), and conveyor-based thermal profiling.
BGA reflow soldering refers to soldering ball grid array components using precise thermal profiles and X-ray inspection since joints are hidden under the package.
Poor reflow process soldering can cause tombstoning, voids, cold joints, overheating, or component misalignment.
Yes, all our reflow soldering services support RoHS-compliant, lead-free pastes with optimized profiles.
In simple terms, reflow soldering is for SMT with solder paste, and flow soldering (wave) is for through-hole parts with molten solder wave contact.